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Stacked Packaging (PoP) Process and Challenges
Jun 16, 2017

With the mobile consumer electronics products for miniaturization, functional integration and large storage space requirements to further enhance the components of the miniaturization of high-density packaging is also more and more, such as multi-module package (MCM), system package (SiP ), Flip chip and other applications are more and more, and component stack packaging (PoP, Package on Package) technology appears more blurred the first-class package and the boundary between the two packages. In the greatly improve the logic of computing functions and storage space at the same time, but also for the end user to provide a free combination of the possibility of choice of equipment, production costs can be more effective control. This is undoubtedly a 3G mobile phone is worth considering the preferred program.

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