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How To Deal With The Black Pad In Reflow Soldering
Jun 16, 2017

1. To reduce the life of nickel tank, strict control in production, control the content of P in about 7%. Nickel tank after a long life in which the P content will increase, which will accelerate the oxidation rate of nickel;

2. The thickness of the nickel layer is at least 4μm, which can make the nickel layer relatively flat; the thickness of the gold layer should not exceed 0.1μm, too much gold will only make the solder embrittlement;

3. Pre-welding baking board on the welding quality will not play a role in promoting too much. Black pad before welding has been produced, but too much baking the coating will deteriorate;

4. Add the reducing agent to the solution of the leaching solution to obtain a semi-reduced semi-reduced composite gold layer, but the cost will be increased by 2.5 times.


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